A paper by scientists at the Hangzhou Dianzi University proposed a 3D-stacked muti-stage inertial microfluidic sort chip to enrich and separate Circulating Tumor Cells (CTCs). The new paper, published ...
Image sensor design has come a long way in just a few years. Some improvements have been slow, quiet and evolutionary. Others have brought a clear step forward in sensor performance. The latest ...
The VD55H1 indirect Time-of-Flight (iToF) sensor from STMicroelectronics brings 3D depth imaging to smartphones and other devices. With its 672×804 back-side illuminated (BSI) pixel array, the sensor ...
Developers of high-end semiconductor products who face manufacturing limitations with respect to die sizes are investing in 3D stacked die technology. These advanced designs already push current ...
The FINANCIAL — Sony Corporation on February 7 announced the development of the industry’s first 3-layer stacked CMOS image sensor with DRAM for smartphones. The new image sensor consists of a DRAM ...
OM System has unveiled the OM-3 Micro Four Thirds mirrorless camera, combining an old-school Olympus-style body with the latest stacked sensor technology. The new model offers buyers many of the ...
When existing advanced 2D designs already push the limits of design-for-test (DFT) tools, what hope do developers have of managing DFT for 3D devices? Can anyone afford the tool run time, on-chip area ...
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